【代徵】日商集團半導體技術業務管理師
Commission
Actively Recruiting
Job Description
工作內容
1.擔任半導體後段製程材料之技術業務窗口。
2.向客戶說明封裝材料、基板材料等產品，並提供含技術背景的專業解說與翻譯支援。
3.協助客戶技術討論，確保溝通順暢，促進業務發展。
4.當客戶進行樣品評估時，需於台灣完成混煉／分散等樣品作業。
Job Requirement
1.具備封裝材料、基板材料等相關開發經驗者佳。
2.具備5年以上半導體後段製程相關工作經驗。
3.對半導體後段製程有廣泛理解者尤佳。
4.日文及英文至少一項語言精通
Job Status Description
Expatriate
No business trip required
Working Hours
Day Shift
Remote Work
On-site
Job Location
台元科技園區
Holiday
Complies with Labor Standards Act
Onboard Day
Based on interview
Number of Vacancies
1 person
Stock and Bonus
None
Experience Required
5-10 years
Education Required
University / Bachelor degree or equivalent
Language Required
English、Japanese
Additional Salary Information
固定或變動薪資因個人資歷或績效而異
Job Infomation
- Hsinchu
- 台元科技園區
- Full-time
- 100000 ~ 125000 TWD / month
- 1200000 ~ 1500000 TWD / year
- No Management Responsibility
-
Collaborating Recruiters1
Job Contact
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- Less than 10 employees
- 台北市中山區吉林路309號
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